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Part Number 111770-1 Details:
Part number 111770-1 is manufactured by Edo Corporation and listed with the item name Microcircuit Memory. Classified under NSN 5962-01-339-5885, the NIIN of this item is 013395885, its INC is 41015, and its NCB code is 01 (USA).
For organization and identification purposes, this item is listed within the Federal Supply Group (FSG) 59 Electrical and Electronic Equipment Components and Class (FSC) 5962 Microcircuits Electronic. These details are important for confirming parts before making a purchase.
Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/terms-conditions.aspx . All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.
How to Get Started on Procurement
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-339-5885 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013395885 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
109421-50 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 115.00 MILLIAMPERES MAXIMUM SUPPLY |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
ADAT | BODY WIDTH | 0.600 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 525.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND W/ENABLE AND ULTRAVIOLET ERASABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS MINIMUM POWER SOURCE |
CZEP | CAPITANCE RATING PER CHARACTERISTIC | 6.00 INPUT PICOFARADS MAXIMUM AND 12.00 OUTPUT PICOFARADS MAXIMUM |
CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM DELAY |
CZER | MEMORY DEVICE TYPE | EPROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
ADAQ | BODY LENGTH | 1.285 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.187 INCHES MAXIMUM |
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